Title:
半導体封止用樹脂組成物および半導体装置
Document Type and Number:
Japanese Patent JP6387696
Kind Code:
B2
Inventors:
Ozaki Yui
Yamashita Katsushi
Satoshi Kashino
Yamashita Katsushi
Satoshi Kashino
Application Number:
JP2014122121A
Publication Date:
September 12, 2018
Filing Date:
June 13, 2014
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G14/073; C08L39/04; C08L61/20
Domestic Patent References:
| JP2012097206A | ||||
| JP10259248A | ||||
| JP2015025120A |
Foreign References:
| WO2014203781A1 | ||||
| WO2014057973A1 |
Other References:
Tsutomu Takeichi,High-performance polymer alloys of polybenzoxazine and bismaleimide,Polymer,日本,2008年,49,1173-1179