Title:
半導体パッケージ用樹脂組成物とこれを用いたプリプレグおよび金属箔積層板
Document Type and Number:
Japanese Patent JP6852249
Kind Code:
B2
Abstract:
The present invention relates to a resin composition for a semiconductor package having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.
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Inventors:
Sim, Jumbo
Sim, Hyeon
Min, Hyun Sung
Kim, Yong Chang
Song, Seung Hyun
Sim, Hyeon
Min, Hyun Sung
Kim, Yong Chang
Song, Seung Hyun
Application Number:
JP2019506370A
Publication Date:
March 31, 2021
Filing Date:
March 08, 2018
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08L63/00; B32B15/08; C08J5/24; C08K3/013; C08K5/17; C08L35/00
Domestic Patent References:
| JP2015080882A | ||||
| JP2011213784A | ||||
| JP2015105304A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
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