PURPOSE: To provide a resin composition for semiconductor sealing, small in a stress generated by a change in temperature or the like and capable of absorbing a stress generated, by mixing an epoxy resin with a curing agent and an inorganic filler surface-treated with a specified silane compound.
CONSTITUTION: An inorganic filler (e.g., silica or alumina) is mixed with a compound of formula I (wherein R1WR8 are each a monovalent hydrocarbon group having at least one group of formula II and at least one reactive organic group or H, R9 is O or a bivalent organic group, R10 is H or a monovalent hydrocarbon group, and m≥0), e.g., formula III, with a high-speed mixer or the like to surface-treat the inorganic filler with the compound of formula I. The surface-treated inorganic filler is mixed with an epoxy resin (e.g., bisphenol A epoxy resin), a curing agent (e.g., novolac phenolic resin) and necessary additives (e.g., flame retardant or colorant) to produce a resin composition for semiconductor sealing.
FURUKAWA HIDENORI
NODA NAOKI
ARIMATSU KOICHIRO
FUKUNAGA SHOICHI
