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Patent Searching and Data


Title:
RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
Document Type and Number:
Japanese Patent JPH06122765
Kind Code:
A
Abstract:

PURPOSE: To improve flowability in molding, curing characteristics, and bending strength by compounding a polymaleimide, a specific allylphenol compd., a polyaminosiloxane, silica, and an organoalkoxysilane compd.

CONSTITUTION: 100 pts.wt. polymaleimide having at least two maleimide groups in the molecule is compounded with an allylphenol compd. having at least two allyl groups in the molecule in an amt. of the allyl group of 0.5-1.5 equivalents based on 1 equivalent of the maleimide group in the polymaleimide, 10-50 pts.wt. polyaminosiloxane of the formula [wherein R1 is CH3, C6H5, or R4NH2 (wherein R4 is alkylene); R2 is R5NH2, R6NHR6NH2, CH3, or C6H5 (wherein R5 and R6 are each R4) provided at least either R1 or R2 is amino; R3 is CH3 or C6H5; (m) is 1 or higher; and (n) is 0 or higher], 20-95vol% silica having a mean particle diameter of 0.01-150μm, and an aminated organoalkoxysilane compd.


Inventors:
TODA ATSUSHI
SUZUKI OSAMU
YAMAMOTO MASAKI
Application Number:
JP23469892A
Publication Date:
May 06, 1994
Filing Date:
September 02, 1992
Export Citation:
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Assignee:
MITSUBISHI CHEM IND
International Classes:
C08F222/40; C08F22/36; C08G73/12; C08K3/36; C08K5/54; C08K5/544; C08L29/10; C08L83/04; C08L83/08; H01L23/29; H01L23/31; (IPC1-7): C08G73/12; C08F222/40; C08K3/36; C08K5/54; C08L29/10; C08L83/08; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hasegawa Moji