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Title:
RESIN COMPOSITION FOR SEMICONDUCTOR SURFACE PROTECTION FILM AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2006096812
Kind Code:
A
Abstract:

To provide a cycloolefinic resin composition containing an epoxy group and most suitable for a surface protection film for a semiconductor element and provide a semiconductor device to improve poor workability in the production of a resin-encapsulated semiconductor device especially having an LOC (lead on chip) structure and exhibiting various excellent reliability by using the cycloolefinic resin composition containing the epoxy group as the surface protection film of a semiconductor element.

The resin composition for a surface-protection film of a semiconductor element contains (A) a cycloolefinic resin having an epoxy group and (B) a photoacid generator.


Inventors:
Kusuki, Junya
Hirano, Takashi
Application Number:
JP2004000282055
Publication Date:
April 13, 2006
Filing Date:
September 28, 2004
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO LTD
International Classes:
C08G59/20; C08F232/00; C08G61/06; H01L23/29; H01L23/31
Domestic Patent References:
JPH10158367A
JP2003186187A
JPH08259784A
JP2000164608A
Foreign References:
WO1998059004A1
WO2004006020A1