Title:
RESIN COMPOSITION, RESIN SHEET, AND CIRCUIT BOARD MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2023037315
Kind Code:
A
Abstract:
To provide a resin composition which uses a cyclic polyolefin resin and is reduced in a dielectric loss tangent, in other words, is excellent in low dielectric characteristics when using a cyclic polyolefin resin, a resin sheet, and a circuit board material using the same.SOLUTION: A resin composition contains a cyclic polyolefin resin, and a magnesium oxide having a BET specific surface area of 10 m2/g or less, and has a dielectric loss tangent at 10 GHz of less than 0.03. A resin sheet is composed of the resin composition. A circuit board material is formed by laminating an insulation layer composed of the resin composition, and a conductor.SELECTED DRAWING: None
Inventors:
SUZUKI SEIGO
Application Number:
JP2021143975A
Publication Date:
March 15, 2023
Filing Date:
September 03, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L53/02; C08K3/22; C08L65/00; H05K1/03
Attorney, Agent or Firm:
Naoya Kamada
Bunji Kamata
Yaichiro Nakatani
Kitagawa Masanori
Bunji Kamata
Yaichiro Nakatani
Kitagawa Masanori
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