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Title:
RESIN COMPOSITION, RESIN SHEET, AND LAYERED STRUCTURE
Document Type and Number:
Japanese Patent JP2012077172
Kind Code:
A
Abstract:

To provide a resin composition and a resin sheet good in adhesiveness to an adherend member, and providing a cured material thereof excellent in water resistance and moisture resistance.

The resin composition and the resin sheet are each used for adhering a heat conductor having a thermal conductivity of ≥10 W/m-K to an electroconductive layer. The resin composition and the resin sheet each comprise a curable compound having an epoxy group and an oxetane group, a curing agent, a filler, a first silane coupling agent having an epoxy group, and a second silane coupling agent having a 4C-12C alkyl group. The resin sheet further comprises, in addition to the above components, a polymer having a weight-average molecular weight of ≥10,000.


Inventors:
KONDO SHUNSUKE
YAMADA YU
MAENAKA HIROSHI
TAKAHASHI RYOSUKE
AOYAMA TAKUJI
INOUE TAKANORI
KUSAKA YASUNARI
WATANABE TAKASHI
Application Number:
JP2010222867A
Publication Date:
April 19, 2012
Filing Date:
September 30, 2010
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L101/00; B32B7/02; B32B15/08; C08K3/00; C08K5/00; C08K5/5415; C08L61/00; C08L63/00; C08L71/00; C08L71/10
Domestic Patent References:
JPS5927945A1984-02-14
JPH0276248A1990-03-15
JP2010157380A2010-07-15
JPS598715A1984-01-18
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama