Title:
RESIN COMPOSITION, SHEET-LIKE COMPOSITION USING THE SAME, CURED PRODUCT, LAMINATE, LAMINATED MEMBER, WAFER HOLDING BODY, AND SEMICONDUCTOR MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP2023010620
Kind Code:
A
Abstract:
To provide a cured film which has excellent pattern processing property and exhibits low thermal expansion property in thick film processing.SOLUTION: A resin composition contains a thermoplastic resin and a thermosetting resin, wherein the thermoplastic resin contains a component (A) and a component (B), the thermosetting resin contains a component (C), the component (A) is a polyimide resin containing 60 mol% or more and 100 mol% or less of a diamine residue having a structure represented by the following general formula (1) in the total diamine residue, and the component (B) is a (meth)acrylic resin having a Tg measured by a differential scanning calorimetric analysis method of 0°C or lower, and a weight average molecular weight of 800,000 to 1,500,000.SELECTED DRAWING: None
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Inventors:
OKADA SEIDAI
KIGUCHI KAZUYA
SHIMADA AKIRA
KIGUCHI KAZUYA
SHIMADA AKIRA
Application Number:
JP2022102458A
Publication Date:
January 20, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L79/08; B32B27/00; C08G73/10; C08K3/013; C08L33/06; H01L21/683