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Patent Searching and Data


Title:
RESIN COMPOSITION AND SHEET MADE THEREOF
Document Type and Number:
Japanese Patent JP2001323167
Kind Code:
A
Abstract:

To provide a resin composition to which heat resistance is donated without extremely damaging transparence of a molded item and to provide a sheet made thereof.

A resin composition comprises 100 pts.wt. of a resin (A) which contains 15 to 50 wt.% of an oxygen atom in a molecule and has a glass transition temperature of 0 to 90°C and tanδ of 0.07 to 1 at 20°C and 0.01 to 20 pts.wt. of a swellable layer silicate (B). A sheet is made of the resin composition and is not less than 50 μm thick.


Inventors:
FUJITA HARUNORI
Application Number:
JP2000138849A
Publication Date:
November 20, 2001
Filing Date:
May 11, 2000
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08J5/18; C08K3/34; C08L33/06; C08L101/00; (IPC1-7): C08L101/00; C08J5/18; C08K3/34; C08L33/06
Attorney, Agent or Firm:
Yoshikazu Miura