RESIN COMPOSITION, RESIN SHEET AND MANUFACTURING METHOD OF PRINTED WIRING BOARD USING THE SAME

Japanese Patent JP3855769

B2

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board which can perform a surface treatment of a resin surface without using a hazardous oxidizing agent, and can ensure an adhesion property between a plating metal and the smoothly conditioned resin surface capable of avoiding the etching accuracy failure caused by its surface roughness and variation of its conductor thickness.
SOLUTION: The manufacturing method of the printed wiring board characterized by including processes of radiating ultraviolet rays to a panel or a base board comprised of an organic polymeric compound or a polymerizable organic compound dispersed with a photocatalyst to form a layer of a degradable resin composition on the surface, followed by removing decomposition products on the surface with an acidic or alkaline solution and performing electroless plating, and if necessary, electric plating.

JP2507923	INDUSTRIAL APPLICABILITY: A method for manufacturing a coated seamless can.
JP2010174242	BIPHENYL ARALKYL TYPE CYANATE ESTER RESIN, RESIN COMPOSITION CONTAINING BIPHENYL ARALKYL TYPE CYANATE ESTER RESIN, AND PREPREG, LAMINATED PLATE, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE OBTAINED USING THE RESIN COMPOSITION

Haruichi Kaichi
Takei Masao

JP2001395484A

December 13, 2006

December 26, 2001

Click for automatic bibliography generation  

Toagosei Co., Ltd.

B32B15/08; C08L101/00; C08K3/00; C08L25/16; C08L35/00; H05K3/18; H05K3/24; (IPC1-7): C08L101/00; B32B15/08; C08K3/00; C08L25/16; C08L35/00; H05K3/18; H05K3/24

JP2000068643A
JP3128908A
JP8253869A

Kiyoshi Kojima

Previous Patent: PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

Next Patent: POROUS ELECTRODE, ELECTROCHEMICAL ELEMENT CONTAINING THE SAME, GAS CONCENTRATION DETECTION SENSOR, M...