Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020033471
Kind Code:
A
Abstract:
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a substrate; and a multilayer printed board and a semiconductor device that employ them.SOLUTION: A curable resin composition contains a maleimide compound (A) represented by the general formula (1) in the figure, and a photocuring initiator (B) whose absorbance at the wavelength of 405 nm (h rays) is 0.1 or more.SELECTED DRAWING: None
Inventors:
KUMAZAWA YUNE
SUZUKI TAKUYA
YOTSUYA SEIJI
SUZUKI TAKUYA
YOTSUYA SEIJI
Application Number:
JP2018161799A
Publication Date:
March 05, 2020
Filing Date:
August 30, 2018
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08F299/02; C08F2/50; C08F22/40; G03F7/004; G03F7/027; G03F7/029; H01B3/30; H01L23/14; H05K3/46
Domestic Patent References:
| JP2002121221A | 2002-04-23 | |||
| JP2005535745A | 2005-11-24 | |||
| JP2011153248A | 2011-08-11 | |||
| JP2020525575A | 2020-08-27 |
Foreign References:
| WO2020045489A1 | 2020-03-05 | |||
| WO2020262580A1 | 2020-12-30 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito