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Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020033472
Kind Code:
A
Abstract:
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a substrate; and a multilayer printed board and a semiconductor device that employ them.SOLUTION: A resin composition contains a maleimide compound (A) represented by the general formula (1) in the figure, and a photocuring initiator (B) whose absorbance at the wavelength of 405 nm (h rays) is 0.1 or more. (In the formula (1), Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; nis a number equal to or greater than 1; and nis a number equal to or greater than 1.)SELECTED DRAWING: None

Inventors:
KUMAZAWA YUNE
SUZUKI TAKUYA
YOTSUYA SEIJI
Application Number:
JP2018161846A
Publication Date:
March 05, 2020
Filing Date:
August 30, 2018
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08F22/40; C08F2/50; G03F7/027; G03F7/029; H05K1/03; H05K3/46
Domestic Patent References:
JP2014132066A2014-07-17
JP2017037116A2017-02-16
JP2021509369A2021-03-25
JP2020525575A2020-08-27
JP2015193725A2015-11-05
JP2018119110A2018-08-02
Foreign References:
WO2020045489A12020-03-05
Other References:
岡崎栄一: "ビスマレイミド化合物の光反応挙動の解析", 東亞合成グループ研究年報ＴＲＥＮＤ, vol. 第９号, JPN6022021973, 2006, ISSN: 0004785894
相田博: "Ｎ−ベンジルマレイミドの溶液光重合・共重合", 福井大学工学部研究報告, vol. 第３７巻第１号, JPN6022021974, 1989, pages 1 - 12, ISSN: 0004785895
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito



 
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