To obtain a resin composition having excellent photosensitivity, providing a cured product excellent in flexibility, solder heat resistance, heat deterioration resistance and electroless gold plating resistance, allowing developing with an organic solvent or a dilute alkaline solution and suitable for a solder resist and an interlayer insulation layer.
The resin composition comprises (A) an oligomer obtained by reacting (a) a polyimide precursor represented by formula (1) (wherein, R1 denotes a 2-30C tetravalent organic group; R2 denotes a 2-240C bivalent organic group; and (n) is an integer of 0 or ≥1) and having a terminal anhydrate group with (b) a hydroxyl group-containing maleimide compound and (c) a polyol compound as an optional component, and (B) a diluent.
OZAKI TORU
YOKOSHIMA MINORU