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Title:
RESIN COMPOSITION, SOLDER RESIST RESIN COMPOSITION, AND CURED PRODUCTS OF COMPOSITIONS
Document Type and Number:
Japanese Patent JP2002317022
Kind Code:
A
Abstract:

To obtain a resin composition having excellent photosensitivity, providing a cured product excellent in flexibility, solder heat resistance, heat deterioration resistance and electroless gold plating resistance, allowing developing with an organic solvent or a dilute alkaline solution and suitable for a solder resist and an interlayer insulation layer.

The resin composition comprises (A) an oligomer obtained by reacting (a) a polyimide precursor represented by formula (1) (wherein, R1 denotes a 2-30C tetravalent organic group; R2 denotes a 2-240C bivalent organic group; and (n) is an integer of 0 or ≥1) and having a terminal anhydrate group with (b) a hydroxyl group-containing maleimide compound and (c) a polyol compound as an optional component, and (B) a diluent.


Inventors:
KOYANAGI TAKAO
OZAKI TORU
YOKOSHIMA MINORU
Application Number:
JP2001121902A
Publication Date:
October 31, 2002
Filing Date:
April 20, 2001
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
G03F7/004; C08F290/06; C08F299/02; C08G59/40; G03F7/027; G03F7/038; H05K3/28; H05K3/46; (IPC1-7): C08F290/06; C08F299/02; C08G59/40; G03F7/004; G03F7/027; G03F7/038; H05K3/28; H05K3/46