Title:
RESIN COMPOSITION, SOLDER RESIST RESIN COMPOSITION AND THEIR CURED PRODUCTS
Document Type and Number:
Japanese Patent JP2002308951
Kind Code:
A
Abstract:
To obtain a resin composition which excels in photosensitivity, excels in the flexibility and soldering heat resistance, resistance to heat deterioration, and electroless gold plating resistance of cured products, can be developed with a dilute alkali solution, and is suited in use for solider resists and interlaminar insulating layers.
The resin composition comprises (A) a maleimide group- containing polycarboxylic acid resin obtained by reacting a reaction product (c) of an epoxy resin (a) having two epoxy groups in the molecule with (b) a maleimide group-containing monocarboxylic acid, (d) a polyol compound (as an optional component), and (e) a tetracarboxylic dianhydride, and (B) a diluent.
Inventors:
KOYANAGI TAKAO
OZAKI TORU
YOKOSHIMA MINORU
OZAKI TORU
YOKOSHIMA MINORU
Application Number:
JP2001112897A
Publication Date:
October 23, 2002
Filing Date:
April 11, 2001
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
G03F7/027; C08F290/06; C08F299/02; C08G59/40; H05K3/28; H05K3/46; (IPC1-7): C08F290/06; C08F299/02; C08G59/40; G03F7/027; H05K3/28; H05K3/46