Title:
RESIN COMPOSITION AND STRUCTURE
Document Type and Number:
Japanese Patent JP2018135447
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that is used for an insulation material such as a laminate or a printed wiring board, or a sealing material to seal a semiconductor element, the resin composition having excellent temperature cycle reliability and high-temperature long-term storage properties, and provide a structure having a cured product of the resin composition.SOLUTION: A resin composition contains a maleimide resin having a biphenyl aralkyl skeleton, represented by formula (1), and a benzoxazine resin, represented by formula (2) or the like. Preferably, the resin composition further contains an inorganic substance and a curing accelerator.SELECTED DRAWING: None
Inventors:
HATA YOKO
YAMASHITA KATSUSHI
TAKAHASHI YUI
YAMASHITA KATSUSHI
TAKAHASHI YUI
Application Number:
JP2017030856A
Publication Date:
August 30, 2018
Filing Date:
February 22, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G14/073; C08G73/00; C08L35/00
Domestic Patent References:
| JP2016529371A | 2016-09-23 | |||
| JP2009001783A | 2009-01-08 | |||
| JP2016088972A | 2016-05-23 |
Foreign References:
| WO2016208667A1 | 2016-12-29 |