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Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
Japanese Patent JP2000119452
Kind Code:
A
Abstract:

To provide ethylenic resin compositions which have the same hand as vinyl chloride based resins without using any vinyl chloride based resins at all and can be inexpensively prepared without crosslinking operation and excel in abrasion resistance and adhesive strength.

Resin compositions comprise (A) 1-79.9 wt.% ethylenic copolymer (A1) composed of at least ethylene units and carboxylic anhydride group- containing monomer units and/or ethylenic copolymer (A2) composed of at least ethylene units and epoxy group-containing monomer units, (B) 0.1-79 wt.% ethylene/ethylenically unsaturated ester copolymer having a content of ethylenically unsaturated ester units of not less than 20 wt.% or saponified product thereof, and (C) 20-98.9 wt.% inorganic filler.


Inventors:
TOGASHI MASAO
SATO JUN
Application Number:
JP22391599A
Publication Date:
April 25, 2000
Filing Date:
August 06, 1999
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08J5/18; C08K3/22; C08K3/26; C08L23/00; C08L31/04; C08L35/02; (IPC1-7): C08L23/00; C08J5/18; C08K3/22; C08K3/26; C08L31/04; C08L35/02
Attorney, Agent or Firm:
Takashi Kuboyama (2 outside)