Title:
金属基板に用いられる樹脂組成物、当該樹脂組成物を含む樹脂接着液及び金属ベース銅張積層板
Document Type and Number:
Japanese Patent JP6832987
Kind Code:
B2
Abstract:
The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.
Inventors:
▲ショー▼ 乃▲東▼
黄 ▲増▼彪
黄 ▲増▼彪
Application Number:
JP2019117806A
Publication Date:
February 24, 2021
Filing Date:
June 25, 2019
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO.,LTD.
International Classes:
C08L63/02; B32B15/08; B32B15/092; C08G59/24; C08G59/50; C08K3/01; C08K3/04; C08K3/22; C08K3/28; C08K3/34; C08K3/38; C08L71/10; C09J7/30; C09J11/04; C09J11/06; C09J163/02
Domestic Patent References:
| JP2011079989A | ||||
| JP2010230944A | ||||
| JP2017179055A | ||||
| JP2011116913A |
Foreign References:
| WO2007119507A1 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office