Title:
RESIN COMPOSITION AND VARNISH AND THEIR APPLICATION
Document Type and Number:
Japanese Patent JP3906426
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin composition and a varnish, excellent in not only heat resistance and adhesion but also preservation stability, readily applicable to fields such as coating or impregnation and further excellent in flexibility of cured products thereof.
SOLUTION: This resin composition comprises a reactional mixture prepared by reacting the following components (A) with (B) until the rate of reaction calculated from an area ratio of a gel permeation chromatography attains 30-90% and the following component (C): (A) a malemide compound, (B) an alkenylphenol compound and (C) a polymerizable unsaturated compound having one or more groups selected from acryloyl group, methacryloyl group and vinyl group bound to the aromatic ring in one molecule. A varnish composed of the resin composition and an organic solvent is useful as a heat-resistant adhesive, a heat-resistant bonding tape, a copper foil with a resin, a laminate using the copper foil with the resin, a heat-resistant film, a prepreg and a laminate using the prepreg.
Inventors:
Takei Masao
Reina Sumi
Takenao Yamamura
Kimura Kaoru
Reina Sumi
Takenao Yamamura
Kimura Kaoru
Application Number:
JP26268597A
Publication Date:
April 18, 2007
Filing Date:
September 09, 1997
Export Citation:
Assignee:
Toagosei Co., Ltd.
International Classes:
B32B15/08; C08L35/06; C08F222/40; C08J5/24; C09D4/02; C09D135/00; C09J4/02; C09J7/02; C09J135/00; C09J135/06; (IPC1-7): C09D4/02; B32B15/08; C08F222/40; C09D135/00; C09J7/02
Domestic Patent References:
| JP56022311A | ||||
| JP7018024A | ||||
| JP6128333A |
Attorney, Agent or Firm:
Kiyoshi Kojima