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Title:
RESIN COMPOSITION, WAVELENGTH CONVERSION MEMBER, LIGHT-EMITTING DEVICE, LED LIGHTING EQUIPMENT, AND OPTICAL MEMBER
Document Type and Number:
Japanese Patent JP2014145012
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for LED lighting, which has high thermal conductivity, superior durability and high transmittance for light and little decrease in the transmittance by a thermal conductive material, and which can respond to a demand for higher luminance of a semiconductor light-emitting element, and to provide a wavelength conversion member, a light-emitting device and LED lighting equipment.SOLUTION: The resin composition comprises a resin and a thermal conductive material. The thermal conductive material has a thermal conductivity of 1.5 W/mK or more. The resin composition is used, which includes the thermal conductive material by 10 wt.% or more and which shows 20% or more total light transmittance when the composition is formed into a plate having 1.0 mm thickness.

Inventors:
NAKANO HIROSHI
SOMA MINORU
Application Number:
JP2013013456A
Publication Date:
August 14, 2014
Filing Date:
January 28, 2013
Export Citation:
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Assignee:
MITSUBISHI CHEMICALS CORP
International Classes:
C08L101/00; C01F11/22; C08K3/00; C09K11/00; C09K11/02; C09K11/08; C09K11/64; C09K11/80; F21V9/16; H01L33/50; H01L33/64; F21Y101/02