Title:
樹脂組成物、半導体用配線層積層体及び半導体装置
Document Type and Number:
Japanese Patent JP7276575
Kind Code:
B2
Abstract:
One aspect of the present invention relates to a resin composition comprising a curable resin and a curing agent, which is used for forming an inter-wiring layer insulating layer in contact with a copper wiring.
Inventors:
Shinichiro Abe
Kazuhiko Kurabuchi
Tomonori Minegishi
Mitsukura and his group
Masaya Toba
Kazuhiko Kurabuchi
Tomonori Minegishi
Mitsukura and his group
Masaya Toba
Application Number:
JP2022117847A
Publication Date:
May 18, 2023
Filing Date:
July 25, 2022
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
H01L23/12; C08F2/50; C08F220/00; C08F222/40; C08G73/10; G03F7/027; G03F7/038; H01L23/14
Domestic Patent References:
| JP20113884A | ||||
| JP2006179549A | ||||
| JP200898370A | ||||
| JP2012227444A | ||||
| JP201688959A |
Foreign References:
| WO2016114286A1 | ||||
| WO2002096969A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Takeshi Nakatsuka
Yoshinori Shimizu
Hiroyuki Hirano
Takeshi Nakatsuka
Previous Patent: tire
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