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Title:
RESIN COMPOSITION WITH ELECTRICAL INSULATION AND LAMINATE FOR CIRCUIT BOARD USING THE SAME COMPOSITION
Document Type and Number:
Japanese Patent JP2006273954
Kind Code:
A
Abstract:

To provide a resin composition with electrical insulation, forming an electrical insulation layer which has excellent flexibility and adhesion to a substrate together with a high resistance to heat and moisture, can be treated at a high temperature in soldering and is stably usable for a long period of time even under the severity conditions of a high temperature and a high humidity such as in an engine room of an automobile.

The resin composition contains (I) a rubbery polymer compound composed of a copolymer of diene monomers, (II) a polymerizable monomer having at least one double bond at the ends, (III) a crosslinking agent and (IV) a thermal conductive inorganic filler, and also optionally contains (V) an unsaturated cyclic oligomer. The electrical insulation layer having excellent flexibility, adhesion, moisture resistance and resistance to thermal deterioration, can be formed from the resin composition.


Inventors:
ITO TOMOYUKI
KOYAMA NOBUAKI
KUSAKAWA KOICHI
Application Number:
JP2005092923A
Publication Date:
October 12, 2006
Filing Date:
March 28, 2005
Export Citation:
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Assignee:
NHK SPRING CO LTD
International Classes:
C08L51/04; B32B15/08; B32B15/085; B32B25/16; B32B25/18; C08F255/00; C08K3/00; C08K5/00; H05K1/03
Domestic Patent References:
JPH0971617A1997-03-18
JPH076624A1995-01-10
JP2004196876A2004-07-15
JPH08208856A1996-08-13
Foreign References:
WO2004039873A12004-05-13
Attorney, Agent or Firm:
Hiroaki Sakai