Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003327821
Kind Code:
A
Abstract:
To provide a resin composition having high dielectric constant to provide a capacitor material built into a substrate.
A matrix resin has a thiourea structure in the resin composition obtained by filling a ceramic powder in a resin. The matrix having the high dielectric constant is obtained by introducing the thiourea structure into the matrix polymer, and, as a result, the dielectric constant of the resin composition combined with the ceramic powder is a high value of ≥50.
Inventors:
Nagai, Akira
Miwa, Takao
Takahashi, Akio
Unno, Morimichi
Miwa, Takao
Takahashi, Akio
Unno, Morimichi
Application Number:
JP2002000139394
Publication Date:
November 19, 2003
Filing Date:
May 15, 2002
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C08L75/02; C08K3/18; C08L61/24; H01B3/00; H01B3/30; H01G4/20; H01L23/12; (IPC1-7): C08L75/02; C08K3/18; C08L61/24; H01B3/00; H01B3/30; H01G4/20; H01L23/12