Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2006312745
Kind Code:
A
Abstract:
To provide a resin composition having an excellent high temperature physical property in particular together with excellent mechanical property, dimensional stability, heat resistance, and flame retardancy, and a substrate material, sheet, laminated board, resin coated copper foil, copper laminate, TAB tape, print substrate, prepreg, and adhesive sheet comprising the resin composition.
The resin composition comprises 100 parts per weight of a (meth)acrylic resin and 0.1 to 65 parts per weight of an inorganic compound, and has an average linear expansion coefficient (α2) between 10°C higher and 50°C higher temperature than its glass transition temperature of not higher than 1.0×10-3[°C-1].
Inventors:
FUJIWARA AKIHIKO
SHIBAYAMA KOICHI
DEGUCHI HIDEHIRO
SHIBAYAMA KOICHI
DEGUCHI HIDEHIRO
Application Number:
JP2006147192A
Publication Date:
November 16, 2006
Filing Date:
May 26, 2006
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L33/04; B32B15/082; C08J5/24; C08K3/00; C09J7/00; C09J11/04; C09J133/04; H05K1/03
Attorney, Agent or Firm:
Miyazaki saki main tax
Table of contents Makoto
Table of contents Makoto
Previous Patent: ANISOTROPIC ELECTRO-CONDUCTIVE ADHESIVE FILM
Next Patent: APPLICATION OF SILICA COMPOSITE RESIN PARTICLE
Next Patent: APPLICATION OF SILICA COMPOSITE RESIN PARTICLE