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Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2010180261
Kind Code:
A
Abstract:

To provide a resin composition which includes a polybutylene terephthalate resin as a main component, and excels in welding property to a polyphenylene sulfide resin composition; and to provide a molded product made from the resin composition.

The resin composition includes: 100 pts.wt. of the total of the polybutylene terephthalate resin (A) and the polyphenylene sulfide resin (B); and 5-20 pts.wt. of an epoxy group-containing olefin resin (C). The resin composition of 100 pts.wt. contains the polybutylene terephthalate resin (A), and the polyphenylene sulfide resin (B) the terminals of a majority of which are a metal carboxylate, at a weight ratio (B)/(A) of 0.2-0.4.


Inventors:
OKUBO KAZUYA
NISHIMOTO HIROAKI
MAEDA YASUO
OTA YUKI
Application Number:
JP2009022211A
Publication Date:
August 19, 2010
Filing Date:
February 03, 2009
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08L67/02; C08L63/10; C08L81/02
Domestic Patent References:
JP2005023093A2005-01-27
JP2005008680A2005-01-13
JP2004323769A2004-11-18



 
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