Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013231171
Kind Code:
A
Abstract:
To provide a resin composition which is capable of providing a molded body that has excellent mechanical strength, heat resistance, electrical conductivity and low-outgas properties.
There is provided a resin composition which contains (A) a cyclic olefin homopolymer that has a glass transition temperature of 101-160°C, (B) a fibrous conductive filler, and (C) at least one elastomer that is selected from the group consisting of olefin-based elastomers and styrene-based elastomers. The content of the elastomer (C) is 5-25 pts.mass relative to 100 pts.mass of the cyclic olefin homopolymer (A). The resin composition preferably further contains a polyethylene (D) having a viscosity averaged molecular weight of ≥1,000,000.
Inventors:
SATO HIROMU
EHATA KATSUYOSHI
NIKAIDO MASANORI
SUZUKI TSUTOMU
MIMURA HIROSHI
EHATA KATSUYOSHI
NIKAIDO MASANORI
SUZUKI TSUTOMU
MIMURA HIROSHI
Application Number:
JP2013077232A
Publication Date:
November 14, 2013
Filing Date:
April 02, 2013
Export Citation:
Assignee:
LION CORP
SHINETSU POLYMER CO
SHINETSU POLYMER CO
International Classes:
C08L65/00; C08K3/04; C08K7/06; C08L23/02; C08L23/06; C08L53/00
Domestic Patent References:
| JP2010138237A | 2010-06-24 | |||
| JP2011073344A | 2011-04-14 | |||
| JP2011006534A | 2011-01-13 |
Foreign References:
| WO2004029152A1 | 2004-04-08 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Tadashi Takahashi
Suzuki Mitsuyoshi