Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014032254
Kind Code:
A
Abstract:
To provide a resin composition for an optical material, from which a resin layer having properties of high transparency, a low refractive index and low thermal expansion can be formed.
The resin composition comprises (A) an epoxy compound having two or more epoxy groups, (B) a compound having a phenolic hydroxyl group, and (C) silica particles having an average particle diameter of 1 nm or more and 70 nm or less. For example, in all atoms of carbon, nitrogen and oxygen constituting the (A) component, when the total number of these atoms and a number n of atoms in which all chemical bonds with other atoms consist of single bonds are denoted by N and n, respectively, n/N is 0.6 or more and 1 or less.
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Inventors:
KAMIYAMA KENICHI
SHIBATA TOMOAKI
MASUDA HIROSHI
SHIBATA TOMOAKI
MASUDA HIROSHI
Application Number:
JP2012171400A
Publication Date:
February 20, 2014
Filing Date:
August 01, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G02B6/12; C08G59/62
Domestic Patent References:
| JP2004346288A | 2004-12-09 | |||
| JP2002069160A | 2002-03-08 | |||
| JP2007031555A | 2007-02-08 | |||
| JP2006291197A | 2006-10-26 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa