Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017125150
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition, a cured product of which is excellent in low contractility and low elasticity.SOLUTION: A curable resin composition is for use in an electronic component and comprises a thermosetting resin, a curing agent, a curing accelerator, a cyclic carbodiimide compound represented by formula (i) and an inorganic filler (X is a divalent or tetravalent organic group; if X is divalent, q is 0, and if X is tetravalent, q is 1; Ar1-Ar4 independently represent a C1-6 aromatic group substituted/unsubstituted with alkyl or phenyl).SELECTED DRAWING: Figure 1
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Inventors:
TAKAHASHI RYOHEI
SAITO CHIORI
SAITO CHIORI
Application Number:
JP2016006253A
Publication Date:
July 20, 2017
Filing Date:
January 15, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L101/00; C08K3/00; C08K5/29; H01L23/29; H01L23/31
Domestic Patent References:
| JP2017031402A | 2017-02-09 | |||
| JP2010285557A | 2010-12-24 | |||
| JP2011256277A | 2011-12-22 | |||
| JP2006176549A | 2006-07-06 | |||
| JPH09316300A | 1997-12-09 |
Foreign References:
| WO2016039486A1 | 2016-03-17 |
Attorney, Agent or Firm:
Shinji Hayami
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