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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2018053092
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of giving an insulating layer which suppresses the occurrence of warpage and is excellent in adhesion to a conductor layer even with low roughness, and to provide a resin sheet, a circuit board, and a semiconductor chip package using the resin composition.SOLUTION: The resin composition contains: (A) a resin having one or more structures selected from a polybutadiene structure, a polysiloxane structure, a (meth)acrylate structure, an alkylene structure, an alkyleneoxy structure, an isoprene structure, an isobutylene structure, and a polycarbonate structure in the molecule; (B) an epoxy resin having an aromatic structure; (C) a carbodiimide compound; (D) a biphenyl aralkyl type resin (excluding ones corresponding to the component (B)); and (E) an inorganic filler.SELECTED DRAWING: None

Inventors:
SAKAUCHI HIROYUKI
Application Number:
JP2016190274A
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
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Assignee:
AJINOMOTO KK
International Classes:
C08L101/02; C08K3/00; C08K5/29; C08L63/00; C08L65/00
Domestic Patent References:
JP2013053278A2013-03-21
JP2013095839A2013-05-20
JP2013189577A2013-09-26
JP2015151483A2015-08-24
Foreign References:
WO2017122460A12017-07-20
Attorney, Agent or Firm:
Sakai International Patent Office