Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023079035
Kind Code:
A
Abstract:
To provide a novel resin composition that can give a cured product having excellent dielectric properties, the resin composition also having excellent flowability.SOLUTION: A resin composition comprises a substituted styrene monomer (A) represented by general formula (1) and an epoxy resin (B) (where R1 is an optionally substituted C1 to 6 alkyl group, or an optionally substituted aryl group, R2 is a substituent, and n is a number selected from 0-4).SELECTED DRAWING: None
Inventors:
OGURA ICHIRO
OKAZAKI DAICHI
OKAZAKI DAICHI
Application Number:
JP2021192436A
Publication Date:
June 07, 2023
Filing Date:
November 26, 2021
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08G59/40; C08F2/44; C08F283/10; C08J5/04; C08K3/013; C08L63/00; C09J4/00; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L23/29
Attorney, Agent or Firm:
Sakai International Patent Office