Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023124504
Kind Code:
A
Abstract:
To provide a resin composition which enables production of a cured product having low dielectric loss tangent and excellent crack resistance.SOLUTION: A resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) a conjugated diene-aromatic vinyl copolymer resin which contains an alkoxysilyl group and may be hydrogenated.SELECTED DRAWING: None
More Like This:
Inventors:
NISHIMURA YOSHIO
Application Number:
JP2022028299A
Publication Date:
September 06, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08G59/40; C08L15/00; C08L63/00; H05K1/03
Attorney, Agent or Firm:
Sakai International Patent Office