Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3280474
Kind Code:
B2
Abstract:
PURPOSE: To obtain a resin composition containing an epoxy resin, a phenol resin curing agent, an inorganic filler, a curing promoter and a specified amount of a specified benzimidazole-based compound, excellent in adhesion to copper, resistance to solder cracking and moisture resistance and useful for surface mounting sealing, etc.
CONSTITUTION: The objective resin composition contains (A) an epoxy resin, (B) a phenol resin curing agent, (C) a benzimidazole-based compound of the formula (R1 is CH, N or CSH), (D) an inorganic filler and (E) a curing promoter as the essential components. The content of the component (C) is 0.05 to 2.0wt.% based on the whole resin composition.
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Inventors:
Shinichi Iwasaki
Application Number:
JP17935593A
Publication Date:
May 13, 2002
Filing Date:
July 20, 1993
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/40; C08G59/56; C08G59/62; C08K3/00; C08K5/00; C08K5/3445; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08G59/40; C08G59/56; C08K3/00; C08L63/00
Domestic Patent References:
| JP5255575A | ||||
| JP4366125A | ||||
| JP1118562A | ||||
| JP5759365A | ||||
| JP559159A | ||||
| JP2269788A | ||||
| JP2219815A | ||||
| JP1198620A |
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