Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3956449
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin composition having good heat resistance and good moldability by mixing a thermoplastic resin with a resin having a glass transition temperature higher than that of the former, an entanglement molecular weight higher than that of the former and a number-average molecular weight in a specified range.
SOLUTION: There is provided a composition comprising a thermoplastic resin (A) and a resin (B) having a glass transition temperature higher than that of component A, entanglement molecular weight of higher than that of component A and an average molecular weight (in terms of the polystyrene as determined by gel permeation chromatography) 0.3-5 times as high as that of the entanglement molecular weight. Component A which can be desirably used is a vinyl chloride (co)polymer resin, AS, ABS resin, or the like. The enlargement molecular weight can be determined by the measurement of dynamic viscoelasticity. Component B which can be desirably used when component A is a vinyl chloride resin is a polymethyl methacrylate, an acrylonitrile/styrene copolymer, or the like.
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Inventors:
Satoshi Yukioka
Application Number:
JP30843597A
Publication Date:
August 08, 2007
Filing Date:
November 11, 1997
Export Citation:
Assignee:
Tosoh Corporation
International Classes:
C08L25/08; C08L101/00; C08L25/12; C08L27/06; C08L33/24; C08L35/06; (IPC1-7): C08L101/00; C08L25/08; C08L27/06; C08L33/24; C08L35/06
Domestic Patent References:
| JP11106438A | ||||
| JP11080473A | ||||
| JP6220214A | ||||
| JP6087997A | ||||
| JP6041328A | ||||
| JP60026052A |
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