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Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS56115337
Kind Code:
A
Abstract:

PURPOSE: A resin composition, having improved moldability, impact and heat resistance, and obtained by incorporating a styrene resin with a specific aromatic polyether-amide copolymer.

CONSTITUTION: (A) A styrene resin, preferably acrylonitrile-butadiene-styrene copolymer resin, is incorporated with (B) an aromatic polyether-amide copolymer having repeating units expressed by formula I or II [R1, R2, R3 and R4 are H, lower alkyl, alkoxyl, chlorine or bromine; R5 and R6 are H, methyl, ethyl or trifluoro(or chloro)methyl; Ar is p- or m- phenylene, diphenylene(ether) or naphthylene; X is -O-, -CH2- or -SO2- and in the m- or p- position to the nitrogen atom], preferably formula III or IV, at a weight ratio between the components (A) and (B) of 20W80: 80W20.


Inventors:
KEIRA SUSUMU
SHIDARA MASASHI
FUKUSHIMA TOSHIAKI
ASAHI TSUTOMU
TAKAGAME HISASHI
Application Number:
JP1662780A
Publication Date:
September 10, 1981
Filing Date:
February 15, 1980
Export Citation:
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Assignee:
HITACHI LTD
HITACHI CHEMICAL CO LTD
International Classes:
C08L25/00; C08L7/00; C08L21/00; C08L23/00; C08L25/04; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L73/00; C08L77/00; C08L77/06; C08L77/10; C08L101/00; (IPC1-7): C08L25/04; C08L77/10