RESIN COMPOSITION

Japanese Patent JPS59164360

A

PURPOSE: To provide a resin compsn. which has excellent compatibility and gives moldings having good mechanical characteristics (flexural strength, impact resistance, etc.) and excellent surface profile, consisting of a polyphenylene sulfide, a polyarylate and an epoxy resin.

CONSTITUTION: 99W1pt.wt. polyphenylene sulfide resin (A) (pref. one contg. at least 70mol% of a structural unit of the formula and having a low degree of crosslinking), 1W99pts.wt. at least one resin (B) selected from polyarylate, polysulfone, polyphenylene oxide, polyether ketone and polyimide, and 0.1W30pts.wt. (per 100pts.wt. of the combined quantity of components A and B) epoxy resin (C) (pref. novolak type epoxy resin) are mixed together, melt-kneaded at 230W400°C and pelletized to obtain the title resin compsn.

JP6953362	Self-healing conductive materials, conductive polymer compounds and polymerizable monomers
JP4469128	Method for producing aromatic polymer
WO/2007/058119	CONDUCTIVE RESIN COMPOSITION, CONDUCTIVE FILM COMPRISING THE SAME, AND RESISTIVE-FILM SWITCH EMPLOYING THE SAME

ISHIKAWA RIYOUICHI
SUGIE TOSHINORI
FURUHATA FUMIHIRO

JP3827783A

September 17, 1984

March 10, 1983

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DAINIPPON INK & CHEMICALS

C08L65/00; C08G59/00; C08G59/40; C08L63/00; C08L63/04; C08L67/00; C08L67/02; C08L71/00; C08L71/12; C08L73/00; C08L79/00; C08L79/04; C08L79/08; C08L81/00; C08L81/02; C08L81/06; (IPC1-7): C08G59/40; C08L67/02; C08L71/04; C08L73/00; C08L79/08; C08L81/02; C08L81/06

JPS5652170A	1981-05-11
JPS53127551A	1978-11-07
JPS58160352A	1983-09-22
JPS5645506A	1981-04-25
JPS5717153A	1982-01-28
JPS51105355A	1976-09-17
JPS5313391A	1978-02-06
JPS5634032A	1981-04-06

US4021596A

1977-05-03

Heiyoshi Odashima

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