Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6267140
Kind Code:
B2
Abstract:
Provided is a resin composition suitable for the formation of an insulating layer on a circuit board, which allows the formation of a conductive layer that has a strong peeling strength even if the insulating layer obtained by curing the resin composition has a low surface roughness. The resin composition comprises (A) a polyfunctional epoxy resin, (B) a phenolic curing agent and/or active ester curing agent, (C) a thermoplastic resin, (D) an inorganic filler, and (E) a predetermined curing accelerator.
More Like This:
Inventors:
Naruhiro Karagawa
Shigeo Nakamura
Nishimura Yoshio
Shigeo Nakamura
Nishimura Yoshio
Application Number:
JP2015040262A
Publication Date:
January 24, 2018
Filing Date:
March 02, 2015
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; B32B27/38; C08G59/68; C08J5/24; H05K1/03
Domestic Patent References:
| JP7304933A | ||||
| JP2007254709A | ||||
| JP10275983A | ||||
| JP2010168470A | ||||
| JP2007254710A | ||||
| JP2005154727A | ||||
| JP2001098049A | ||||
| JP2007291368A | ||||
| JP2005154727A | ||||
| JP20068788A | ||||
| JP2010129816A | ||||
| JP2009227962A |
Foreign References:
| WO2005095517A1 |
Attorney, Agent or Firm:
Takashima Ichi
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Junzo Koike
Hirofumi Toma
Atsuko Akai
Tomiya Tozaki
Shigehisa Takayama
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Junzo Koike
Hirofumi Toma
Atsuko Akai
Tomiya Tozaki
Shigehisa Takayama