Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6904221
Kind Code:
B2
Abstract:
An object of the present invention is to provide a resin composition or the likes which can obtain a cured product having a low linear thermal expansion coefficient, capable of suppressing warpage, and capable of suppressing generation of flow marks. The solution is a resin composition, comprising: (A) an epoxy resin; (B) a curing agent; (C) a compound with a rotaxane structure; and (D) an inorganic filler.
Inventors:
Hiroyuki Sakauchi
Application Number:
JP2017214733A
Publication Date:
July 14, 2021
Filing Date:
November 07, 2017
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08K3/013; C08L5/16; C08L71/02; H05K1/03
Domestic Patent References:
| JP2017199654A | ||||
| JP2016225451A | ||||
| JP2006316089A | ||||
| JP2016160316A |
Foreign References:
| WO2015129513A1 | ||||
| WO2016084345A1 |
Attorney, Agent or Firm:
Sakai International Patent Office