Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH05156171
Kind Code:
A
Abstract:
PURPOSE:To provide a resin composition prepared by dispersing fine polymer particles in a synthetic resin improved in impact resistance and solvent resistance, having light diffusion properties and suppressed in the adverse effect of the emulsifier originating in the fine polymer particles. CONSTITUTION:The objective resin composition is prepared by dispersing 1-150 pts.wt. fine polymer particles in 100 pts.wt. synthetic resin, wherein the fine polymer particles are prepared by polymerizing an ethylenically unsaturated monomer with an anionic emulsifier copolymerizable therewith in an aqueous medium.
Inventors:
MATSUMOTO YOSHIKI
DATE SHINJI
KOYAMA TERUHISA
DATE SHINJI
KOYAMA TERUHISA
Application Number:
JP31880991A
Publication Date:
June 22, 1993
Filing Date:
December 03, 1991
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F2/26; C08F2/24; C08L33/00; C08L33/04; C08L101/00; (IPC1-7): C08F2/26; C08L33/00; C08L101/00
Attorney, Agent or Firm:
Mitsuhiro Moroishi (1 person outside)