Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0693085
Kind Code:
A
Abstract:
PURPOSE: To obtain a resin composition for sealing semiconductors excellent in low stress properties and crack and moisture resistance.
CONSTITUTION: The resin composition comprises a polyorganosiloxane having epoxy group in the side chain or the terminal and 200-400g/mol epoxy equiv. and a γ-ureidopropyltriethoxysilane in a resin composition composed of a thermosetting resin consisting essentially of a polymaleimide compound and an inorganic filler. This resin composition is suitable for sealing semiconductor devices requiring low stress properties, solder crack and moisture resistance.
Inventors:
KITAHARA MIKIO
TANAKA JUNSUKE
KUBO TAKAYUKI
TORIKAI MOTOYUKI
ASAHINA KOTARO
TANAKA JUNSUKE
KUBO TAKAYUKI
TORIKAI MOTOYUKI
ASAHINA KOTARO
Application Number:
JP24339692A
Publication Date:
April 05, 1994
Filing Date:
September 11, 1992
Export Citation:
Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08G59/30; C08G59/40; H01L23/29; H01L23/31; (IPC1-7): C08G59/40; C08G59/30; H01L23/29; H01L23/31
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