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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH11228767
Kind Code:
A
Abstract:

To obtain resin composition which has a low friction coefficient, good sliding properties and wear resistance as well a good flow properties and mold reliability, has good mold processiblities such as a mold stain inhibiting property, or the like, and is suitably used as a slide component.

This composition contains, to (A) 100 pts.wt. at least one resin selected from the group consisting of an ABS resin and a polystyrene resin, (B) from 0.1 to 10 pts.wt. liquid or viscous ethylene/α-olefin random copolymer wherein the number average molecular weight (Mn) is within the range of from 500 to 10,000, the molecular weight distribution (Mw/Mn) is within the range of from 1.1 to 4.0, the ethylene content is within the range of from 20 to 80 mol.% and the carbon number of the α-olefin is from 3 to 20.


Inventors:
KANASHIGE RYOSUKE
HIRANO HIDEKI
TANAKA MASAHIDE
Application Number:
JP34143698A
Publication Date:
August 24, 1999
Filing Date:
December 01, 1998
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
F16C33/20; C08L25/04; C08L55/02; (IPC1-7): C08L25/04; C08L55/02; F16C33/20
Attorney, Agent or Firm:
Yanagihara