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Title:
樹脂組成物、接合体及び半導体装置
Document Type and Number:
Japanese Patent JP6729143
Kind Code:
B2
Abstract:
A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.

Inventors:
Hiroto Akaike
Mountain Saki Kazuhiko
Application Number:
JP2016150723A
Publication Date:
July 22, 2020
Filing Date:
July 29, 2016
Export Citation:
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Assignee:
Mitsubishi Materials Corporation
International Classes:
C08L101/00; C08K3/08; C08K9/02; C08K9/04; C08L101/02; H01L21/52
Domestic Patent References:
JP2007056111A
JP2011057859A
JP2011023631A
JP2015177182A
JP2014170252A
JP2000038510A
JP2014531495A
JP2008179526A
Foreign References:
WO2012118061A1
WO2016103528A1
WO2007069674A1
WO2015147267A1
CN104673113A
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga