Title:
樹脂組成物および電子部品構造体
Document Type and Number:
Japanese Patent JP7413659
Kind Code:
B2
Abstract:
To provide a resin composition which can be suitably used for manufacturing a heat radiation material excellent in heat conductivity, and an electronic component structure including a heat radiation layer formed of a cured product of the resin composition.SOLUTION: A resin composition contains a thermosetting resin and a boron nitride filler, when the resin composition is coated to a base material, is heated and dried and is high-pressure pressed to prepare a test film with a film thickness of 100 μm or more and 200 μm or less, and a polished surface obtained by precisely polishing the surface of the test film is observed by a scanning electron microscope, the number of microcracks with a length of 1 μm or more and a width of 0.1 μm or more and 5 μm or less observed in the polished surface is 500 pieces/mm2 or more and 5,000 pieces/mm2 or less.SELECTED DRAWING: None
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Inventors:
Mika Tsuda
Application Number:
JP2019083831A
Publication Date:
January 16, 2024
Filing Date:
April 25, 2019
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L101/00; C08K3/01; C08K3/38; C09K5/14; H01L23/36; H05K7/20
Domestic Patent References:
| JP2016094599A | ||||
| JP2012212727A | ||||
| JP2010235949A |
Foreign References:
| WO2016002891A1 | ||||
| WO2016002892A1 | ||||
| WO2018235920A1 | ||||
| WO2008087972A1 | ||||
| CN109401313A |
Attorney, Agent or Firm:
Shinji Hayami