Title:
樹脂組成物、成形体、電子部品、及び電子機器
Document Type and Number:
Japanese Patent JP7459443
Kind Code:
B2
Abstract:
A resin composition is provided. The resin composition comprises an acrylonitrile butadiene styrene resin, a polystyrene resin, a polycarbonate resin, and a phosphorus compound. The amount of the polystyrene resin is equal to or greater than the amount of the acrylonitrile butadiene styrene resin. The amount of the polycarbonate resin is from 70 to 90 parts by mass with respect to 100 parts by mass of all the resins. The phosphorus compound contains a phosphazene compound, and the amount of the phosphazene compound is from 0.1 to 4.0 parts by mass with respect to 100 parts by mass of all the resins.
Inventors:
Natsuki Koike
Yasushi Akiba
Mitsuyo Matsumoto
Yoshitaka Sekiguchi
Yasushi Akiba
Mitsuyo Matsumoto
Yoshitaka Sekiguchi
Application Number:
JP2019130084A
Publication Date:
April 02, 2024
Filing Date:
July 12, 2019
Export Citation:
Assignee:
株式会社リコー
International Classes:
C08L69/00; C08K3/32; C08K5/5399; C08L25/04; C08L55/02
Domestic Patent References:
| JP2010202782A | ||||
| JP2016003290A | ||||
| JP11181429A | ||||
| JP2005532461A | ||||
| JP2017095667A | ||||
| JP2014074148A | ||||
| JP2014133881A | ||||
| JP2006336007A | ||||
| JP7304943A |
Attorney, Agent or Firm:
Masami Sakai