Title:
ビニル環状炭化水素重合体を含有する樹脂組成物及び成形物
Document Type and Number:
Japanese Patent JP4343424
Kind Code:
B2
Abstract:
A moulding is prepared from a resin composition comprising (A) at least 1 vinylic cyclic hydrocarbon polymer chosen from vinyl aromatic polymers and their hydrogenation products, vinylcyclohexene polymers and their hydrogenation products, and vinylcyclohexane polymers; and (B) 1 or more materials selected from among compounding agents incompatible with the polymer(s), organic compounds with at least 1 alcoholic hydroxyl group and 1 or more ether or ester bonds. For the mouldings, its initial light transmittance (a) at any wavelength in the range of 400-800 nm and its light transmittance (b) after being held in an atmosphere at 65[deg]C and relative humidity of 90% for 1000 hrs. satisfy the relationship of (I): [(b)/(a)] X 100 >= 70. Also claimed are the following: (i) a resin composition comprising (A) at least 1 vinylic cyclic hydrocarbon polymer chosen from hydrogenated vinyl aromatic polymers, vinylcyclohexene polymers and their hydrogenation products, and vinylcyclohexane polymers, and (B) an organic compound with 1 or more alcoholic hydroxyl groups and at least one ether bond; (ii) a similar composition containing (A) and (B) an organic compound with 1 or more alcoholic hydroxyl groups and ester bonds; and (iii) a process for making the moulding by melting (A) and (B3) a resin composition containing a compounding agent incompatible with the above polymer, at resin temperature of 220-320[deg]C in a moulding machine at resin temperature of not less than 250[deg]C with residence time of not > 30 mins. to control the formation.
More Like This:
Inventors:
Teruhiko Suzuki
Tsutomu Nagamune
Sadaji Ohara
Tsutomu Nagamune
Sadaji Ohara
Application Number:
JP2000504196A
Publication Date:
October 14, 2009
Filing Date:
July 28, 1998
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08L25/02; A61M5/178; C08K5/06; C08K5/10; C08K5/103; C08L23/20; C08L47/00; G02B1/04; G11B7/135; G11B7/244; G11B7/253; G11B11/10; C08L71/02
Domestic Patent References:
| JP6199950A | ||||
| JP9147626A | ||||
| JP5039403A |
Foreign References:
| WO1996010596A1 |
Attorney, Agent or Firm:
Shigeaki Nishikawa
Naoto Noda
Yasuhide Nomura
Naoto Noda
Yasuhide Nomura