Title:
樹脂組成物、プリプレグ、金属張積層体、プリント配線基板および電子機器
Document Type and Number:
Japanese Patent JP6829030
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of obtaining an insulating layer which is excellent in workability and satisfies dielectric characteristics and solder heat resistance in a high frequency region required for an insulating layer for electronic components such as a printed wiring board.SOLUTION: A resin composition contains a cyclic olefin copolymer (A) having a glass transition temperature of 150°C or higher and lower than 250°C, and a crosslinking agent (B). A ratio ((A)/(B)) of a content of the cyclic olefin copolymer (A) to a content of the crosslinking agent (B) in the resin composition is 10 or more and 200 or less.SELECTED DRAWING: None
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Inventors:
Hirohiko Murase
Atsushi Morita
Takashi Oikawa
Junji Saito
Atsushi Morita
Takashi Oikawa
Junji Saito
Application Number:
JP2016169452A
Publication Date:
February 10, 2021
Filing Date:
August 31, 2016
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L45/00; B32B15/08; C08F232/00; C08J5/24; H05K1/03
Domestic Patent References:
| JP2016017089A |
Foreign References:
| WO2012046443A1 |
Attorney, Agent or Firm:
Shinji Hayami