樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

Japanese Patent JP7380944

B2

Provided are; a novel resin composition having excellent dielectric properties; a prepreg; a metal foil-clad laminated sheet; a composite resin sheet; a printed wiring board; and a semiconductor device. This resin composition contains: a polymer (A) having a constituent unit represented by formula (V); an inorganic filler (B) containing an organic group that includes a carbon-carbon unsaturated bond; and another thermosetting compound (C) that does not correspond to the polymer (A) or the inorganic filler (B). In formula (V), Ar denotes an aromatic hydrocarbon linking group. * denotes a bonding position.

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JP2002003685	RESIN COMPOSITION LOW IN BOTH HYGROSCOPIC PROPERTY AND BIREFRINGENCE AND FORMING MATERIAL, SHEET OR FILM AND OPTICAL PARTS OBTAINED FROM THE RESIN COMPOSITION
JP2007517930	Flame Retardant System and Flame Retardant Polymer Composition Based on Phosphorus Compounds

Yuji Nakashima
Kazuhiro Hashiguchi
Shunsuke Hirano
Keiichi Hasebe

JP2023501347A

November 15, 2023

July 22, 2022

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Mitsubishi Gas Chemical Co., Ltd.

C08L25/02; C08G73/12; C08J5/24; C08K3/00; C08K3/36; C08K9/04; H05K1/03

JP2020002217A
JP2018504511A
JP2016210856A
JP2010111758A

WO2020175537A1
WO2020175538A1
WO2019026927A1

Sykes Patent Attorney Corporation

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