Title:
樹脂組成物、樹脂膜、及び電子部品
Document Type and Number:
Japanese Patent JP6947027
Kind Code:
B2
Abstract:
A resin composition comprising a binder resin (A), a compound (B) having an acidic group or latent acidic group, an organic solvent (C), and a compound (D) having one atom selected from a silicon atom, titanium atom, aluminum atom, and zirconium atom and having a hydrocarbyloxy group or hydroxy group bonded with that atom, wherein the compound (B) is at least one type selected from the group consisting of an aliphatic compound, aromatic compound, and heterocyclic compound, and a content of the compound (B) is 0.1 to 2.5 parts by weight and a content of the compound (D) is 2.2 to 7.0 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.
Inventors:
Takashi Tsutsumi
Yumi Osako
Yumi Osako
Application Number:
JP2017500652A
Publication Date:
October 13, 2021
Filing Date:
February 12, 2016
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08L65/00; C08K5/09; C08K5/36; C08K5/541; C08K5/56
Domestic Patent References:
| JP2004051876A | ||||
| JP2001281861A | ||||
| JP2001281853A | ||||
| JP2013210607A | ||||
| JP2000338664A |
Foreign References:
| WO2010110323A1 | ||||
| WO2012133617A1 | ||||
| WO2011040324A1 |
Attorney, Agent or Firm:
Eternal patent business corporation
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