Title:
樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置
Document Type and Number:
Japanese Patent JP7342358
Kind Code:
B2
Abstract:
To provide a resin composition for circuit board excellent in low water absorption characteristics.SOLUTION: A resin composition for circuit board contains an epoxy resin, an indene-coumarone resin and an inorganic filler, in which a dielectric loss tangent in a cured product of the resin composition when being measured at 10 GHz satisfies characteristics of 3.5×10-3 or less.SELECTED DRAWING: Figure 1
Inventors:
Noriyuki Daito
Application Number:
JP2018243297A
Publication Date:
September 12, 2023
Filing Date:
December 26, 2018
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; B32B27/38; C08G59/42; C08J5/24; C08K3/013; C08K3/36; C08K5/29; C08L21/00; C08L45/02; C08L61/14; H05K1/03
Domestic Patent References:
| JP2002047394A | ||||
| JP2004099810A | ||||
| JP1249824A | ||||
| JP2018133416A | ||||
| JP2017179014A | ||||
| JP2018090708A | ||||
| JP2011246612A | ||||
| JP2017177469A | ||||
| JP6107905A | ||||
| JP2002356538A |
Attorney, Agent or Firm:
Shinji Hayami