Title:
RESIN COMPOUND MATERIAL FOR MOLDING
Document Type and Number:
Japanese Patent JP2011219715
Kind Code:
A
Abstract:
To provide a resin compound material for molding using a vegetable resource as a main raw material, and a molded body having excellent heat resistance and provided with flame retardancy and antibacterial properties.
The resin compound material for molding contains lignin, wherein the lignin is soluble in an organic solvent and contained therein in an amount of 5-90 mass%. The molded body is formed using the resin compound material.
Inventors:
KOFUNE MIKA
KOYAMA NAOYUKI
GOTO AKIHITO
KIKUCHI IKUKO
SUKEGAWA TOMOJI
KOYAMA NAOYUKI
GOTO AKIHITO
KIKUCHI IKUKO
SUKEGAWA TOMOJI
Application Number:
JP2010168053A
Publication Date:
November 04, 2011
Filing Date:
July 27, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L97/00; C08H7/00