Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN CURED STATE MONITORING DEVICE AND RESIN CURED STATE MONITORING METHOD
Document Type and Number:
Japanese Patent JP2013137199
Kind Code:
A
Abstract:

To provide a resin cured state monitoring device and a resin cured state monitoring method for accurately detecting a cured state of a resin regardless of thickness of the resin.

A resin cured state monitoring device includes: a light source 12 for irradiating a resin 22 with light; a light detection unit 16 for detecting fluorescence emitted from the resin; and a control processing unit 10. Since wavelength distribution of the fluorescence emitted from the resin 22 varies as curing of the resin 22 proceeds, a signal output from the light detection unit 16 is subjected to signal processing by the control processing unit 10 to obtain the wavelength distribution of the fluorescence, thereby detecting a cured state of the resin 22.


More Like This:
JP3585753PHOTOGRAPHING SYSTEM
JP4262248Coated fragrance inspection device and tobacco manufacturing machine equipped with this
JP2012039927APPARATUS AND METHOD FOR ANALYZING CELL IMAGE
Inventors:
SAKAI SATORU
NISHIYAMA YOJI
AMEMIYA SATOSHI
HOKARI MAMORU
OKIYAMA KOICHI
Application Number:
JP2011287108A
Publication Date:
July 11, 2013
Filing Date:
December 28, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJITSU LTD
International Classes:
G01N21/64
Domestic Patent References:
JPH10503838A1998-04-07
JP2011080974A2011-04-21
JP2009075002A2009-04-09
JPH0341112A1991-02-21
JP2006138875A2006-06-01
JP2011503552A2011-01-27
Foreign References:
US20080101657A12008-05-01
US5100802A1992-03-31
US5633313A1997-05-27
US5955002A1999-09-21
US5486915A1996-01-23
Attorney, Agent or Firm:
Keizo Okamoto



 
Previous Patent: 密封装置及び密封構造

Next Patent: IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY METHOD