To achieve high brightness and to improve heat resistance, moisture resistance, and durability by encapsulating a light emitting part with transparent resin with a high refraction made of polymer in at least one type of structure unit which is selected by a specific expression.

Transparent resin 5 consists of resin having a refractive index of 1.55 or higher made of a polymer in at least one type of structure unit selected from expressions I and II. In a light emitting diode 1, at least a light emitting part 4 is encapsulated with the transparent resin 5, where X represents a halogen atom excluding fluorine and l, m, and n are integers (0 or 1-4) in the expressions I and II. Y1, Y2, Y3, and Y4 are connection groups and may be equal or different. Also, R1, R2, and R4 are alkylene and aralkylene groups which may contains O or S with 0 or 1-10 carbons. Z is either O or S and R3 is alkylene and aralkylene groups which may be container O or S with 1-10 carbons.